?Modified Polyamide hot melt adhesive series are polyamide hot melt adhesive resin modified by Polycondensation. It has good heat/cold/oil resistance, it is odorless, flexibile, fast curing and etc. It has good adhesion with metal or nonmetal material and has been widely used in electronics, shoe, automobile filter, heat-shrink tube and so on. It is a new type of high performance polyamide hot melt adhesive.
Technical Data
|
Series
|
Type
|
Form
|
Melting Range DSC (℃)
|
Melting Flow Index g/10 min, 160℃
|
Press Condition
|
|
Time (S)
|
Temp (℃)
|
Press (kgf/㎡)
|
| PA Material |
2080 |
P,G |
80-90 |
45-75 |
15 |
100 |
2 |
|
Series
|
Type
|
Form
|
Melting Range DSC (℃)
|
Viscosity (210℃ Pa.S)
|
| PA Material |
2120 |
G |
110-125 |
3000-5000 |
|
Series
|
Type
|
Form
|
Softening Point (℃)
|
Viscosity (210℃ Pa.S)
|
| PA Material |
2170 |
G |
145-155 |
3000-7000 |
| 2171 |
G |
155-165 |
3000-7000 |
| 2173 |
G |
185 |
3000-7000 |
| 2175 |
G |
195 |
2000-8000 |
| 2120 |
G |
110 |
3000-5000 |
Remark
1.Product technical data is based on typical product, it does not represent our guarantee to this product. Please consult us for specific product data.
2.Specification: 0-80um is used for starch producing of heat transfer, flocking and gliding. 0-120, 0-160, 0-170um for powder dot process. 80-170 and 80-200um for double dot process for interlining. 5-200, 150-250 and 180-420um for powder scattering process. We can make different particle size for customized requirements.
3.Form: P: powder G: granule
Application
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